XCZU7EV-2FBVB900E
XCZU7EV-2FBVB900E
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Description:  IC SOC CORTEX-A53 900FCBGA
Manufacturer:  Xilinx
History Price: $4,033.17000
In Stock: 41800
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XCZU7EV-2FBVB900E Specification
Specification
Mfr Part
XCZU7EV-2FBVB900E
Category
Embedded - System On Chip (SoC)
Manufacturer
Xilinx
Series
Zynq UltraScale+ MPSoC EV
Packaging
Tray
Status
Active
Environmental Compliance
Lead Free
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS
Compliant
HS Code
-
Technical Parameter
Architecture
MCU, FPGA
Core Processor
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2
Flash Size
-
RAM Size
256KB
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed
533MHz, 600MHz, 1.3GHz
Primary Attributes
Zynq?UltraScale+? FPGA, 504K+ Logic Cells
Operating Temperature
0 ℃ ~ 100 ℃ (TJ)
Package / Case
900-BBGA, FCBGA
Supplier Device Package
900-FCBGA (31x31)
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XCZU7EV-2FBVB900E Description

## Overview of Xilinx XCZU7EV-2FBVB900E

The Xilinx XCZU7EV-2FBVB900E is a high-performance System on Chip (SoC) that is part of the Zynq UltraScale+ MPSoC family. This device combines a powerful ARM Cortex-A53 processor with programmable logic, making it ideal for a range of applications, including telecommunications, automotive, industrial automation, and machine learning.

## Key Features

1. Processor Architecture:
- ARM Cortex-A53: The XCZU7EV integrates a quad-core ARM Cortex-A53 application processor.
- Performance: Each core can operate at up to 1.5 GHz, enabling efficient multitasking and processing capabilities.
- ARM Mali-400 GPU: It includes a graphics processing unit for enhanced visual performance.

2. Programmable Logic:
- FPGA Fabric: The device features 7-series FPGA logic cells, providing significant flexibility and customization options for hardware acceleration.
- Logic Cells: Approximately 6,840 logic cells are available for implementing custom logic functions.
- DSP Slices: It includes 220 DSP slices for high-performance digital signal processing applications.

3. Memory Interface:
- DDR4 Memory Controller: Supports DDR4 SDRAM with a maximum bandwidth of up to 51.2 GB/s.
- Memory Capacity: Configurable memory interfaces allow for up to 4 GB of RAM.

4. Connectivity Options:
- High-Speed Interfaces: Includes multiple high-speed interfaces such as PCIe Gen3, which supports up to 32 GT/s.
- Ethernet Support: Integrated 10/100/1000 Ethernet interfaces for networking applications.
- USB Interface: USB 3.0 interface for high-speed data transfer.

5. I/O Capabilities:
- GPIO Pins: Up to 88 general-purpose I/O pins, allowing for extensive interfacing with external devices.
- Configurable I/O Standards: Supports various I/O standards such as LVTTL, LVCMOS, and SSTL.

6. Power Management:
- Power Supply Voltage: Operates at a core voltage of 0.85V to 1.0V, with I/O voltages configurable from 1.8V to 3.3V.
- Low Power Modes: Features multiple low-power modes to reduce energy consumption in idle states.

## Electrical Specifications

1. Absolute Maximum Ratings:
- Supply Voltage (VCC): 0.5V to 1.15V for core; 0.5V to 3.6V for I/O.
- Storage Temperature: -65°C to +150°C.
- Operating Temperature Range: -40°C to +100°C for industrial applications.

2. Recommended Operating Conditions:
- Core Voltage (VCC): 0.85V to 1.0V.
- I/O Voltage: 1.8V to 3.3V depending on configuration.
- Operating Temperature: 0°C to 100°C for commercial applications.

3. Performance Characteristics:
- Maximum Device Power Consumption: Approximately 25W in full operation.
- Typical Power Consumption: Around 10W under typical workloads.

## Applications

The XCZU7EV-2FBVB900E is designed for a broad spectrum of applications:

1. Telecommunications: Ideal for baseband processing, radio signal processing, and software-defined radio (SDR) implementations.

2. Automotive: Utilized in advanced driver-assistance systems (ADAS), infotainment systems, and vehicle-to-everything (V2X) communications.

3. Industrial Automation: Suitable for real-time control systems, robotics, and machine vision applications.

4. Machine Learning: Supports deep learning inference engines and accelerators, allowing for efficient AI processing in edge devices.

## Development Tools

Xilinx provides an extensive suite of development tools to aid in the design and implementation of applications using the XCZU7EV-2FBVB900E:

- Vivado Design Suite: Comprehensive design tools for integrating hardware and software components.
- Vitis Unified Software Platform: Enables software development for both embedded applications and Linux-based systems.
- Zynq UltraScale+ MPSoC Evaluation Kit: Hardware platform for prototyping and testing designs before deployment.

## Conclusion

The Xilinx XCZU7EV-2FBVB900E SoC is a versatile and powerful solution for modern embedded applications. Its combination of high-performance processing capabilities, flexible programmable logic, and extensive connectivity options make it suitable for a wide range of industries. Whether developing advanced telecommunications systems, automotive applications, or machine learning solutions, this device offers the necessary features and performance to meet demanding requirements.
XCZU7EV-2FBVB900E Compare Parts
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  • Customer Reviews
    4.95 out of 5.00 stars from 76 customer reviews from all over the world
    Lotte van der Veen
    Netherlands
    5 stars
    2026-04-16 13:00
    All ok, thank you!
    Hugo
    Spain
    5 stars
    2026-04-15 08:14
    All right. Received within time
    Felipe Soto
    Spain
    5 stars
    2026-04-14 09:01
    Received perfectly. Welded a unit on its corresponding printed circuit board working perfectly to replace a faulty unit on an Arduino Nano plate.
    Katharina Schneider
    Germany
    5 stars
    2026-04-14 08:46
    2 weeks for delivery. The chips work fine
    Paul Roy
    France
    5 stars
    2026-04-14 05:40
    Corresponds to my use
    Laura Cristina
    Spain
    5 stars
    2026-04-14 04:28
    Tested, works as expected.