XCZU15EG-1FFVB1156I
XCZU15EG-1FFVB1156I
Active
Description:  IC SOC CORTEX-A53 1156FCBGA
Manufacturer:  Xilinx
History Price: $5,921.22000
In Stock: 27700
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XCZU15EG-1FFVB1156I Specification
Specification
Mfr Part
XCZU15EG-1FFVB1156I
Category
Embedded - System On Chip (SoC)
Manufacturer
Xilinx
Series
Zynq UltraScale+ MPSoC EG
Packaging
Tray
Status
Active
Environmental Compliance
Lead Free
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS
Compliant
HS Code
-
Technical Parameter
Architecture
MCU, FPGA
Core Processor
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2
Flash Size
-
RAM Size
256KB
Peripherals
DMA, WDT
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed
500MHz, 600MHz, 1.2GHz
Primary Attributes
Zynq?UltraScale+? FPGA, 747K+ Logic Cells
Operating Temperature
-40 ℃ ~ 100 ℃ (TJ)
Package / Case
1156-BBGA, FCBGA
Supplier Device Package
1156-FCBGA (35x35)
XCZU15EG-1FFVB1156I Related Parts
XCZU11EG-1FFVC1156E
XCZU11EG-1FFVC1156E
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IC SOC CORTEX-A53 1156FCBGA
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XCZU11EG-L2FFVC1156E
XCZU11EG-L2FFVC1156E
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XCZU15EG-1FFVB1156E
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IC SOC CORTEX-A53 1156FCBGA
XCZU15EG-1FFVC900E
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XCZU15EG-2FFVB1156E
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XCZU15EG-2FFVB1156I
XCZU15EG-2FFVB1156I
Xilinx
IC SOC CORTEX-A53 1156FCBGA
XCZU15EG-1FFVB1156I Description
Introduction to Xilinx XCZU15EG-1FFVB1156I

The Xilinx XCZU15EG-1FFVB1156I is a member of the Zynq UltraScale+ MPSoC (Multiprocessor System-on-Chip) family, which combines a powerful ARM Cortex-A53 application processor with programmable logic in a single device. This architecture allows for high-performance computing and flexible hardware acceleration, making it ideal for a wide range of applications, including telecommunications, automotive, industrial automation, and advanced video processing.

Key Specifications

1. Architecture:
- Type: Zynq UltraScale+ MPSoC.
- Processing System: Quad-core ARM Cortex-A53 (up to 1.5 GHz) and dual-core ARM Cortex-R5 real-time processors.
- Programmable Logic: FPGA fabric with 15K logic cells.

2. Performance:
- Total Logic Cells: Approximately 15,000, providing significant flexibility for custom hardware designs.
- DSP Slices: 60 DSP48E2 slices for high-performance digital signal processing tasks.
- Block RAM: 5.4 MB of on-chip Block RAM for data storage and buffering.

3. Connectivity:
- High-Speed Interfaces: Supports multiple high-speed interfaces including PCIe Gen3 (up to x8), Gigabit Ethernet (up to 10GbE), and USB 3.0.
- Serial Interfaces: Includes I2C, SPI, UART, CAN, and more for versatile peripheral connectivity.

4. Memory Support:
- External Memory Interface: Supports DDR4 memory with a maximum bandwidth of up to 68 GB/s.
- Memory Types: Compatible with various memory types including DDR3L/DDR4 SDRAM.

5. Power Consumption:
- Power Supply Voltage: Typically operates at 0.85V for the core and 1.8V for I/O.
- Power Consumption: Designed for efficiency; power consumption can vary based on configuration but typically operates within a range conducive to embedded applications.

6. Thermal Characteristics:
- Operating Temperature Range: Commercial grade (-0°C to +100°C) or industrial grade (-40°C to +100°C), allowing deployment in diverse environmental conditions.
- Package Type: FFGB1156 package type with dimensions suitable for high-density applications.

7. Security Features:
- Integrated security features including secure boot and device authentication capabilities to protect against unauthorized access and tampering.

8. Development Ecosystem:
- Development Tools: Supported by Xilinx Vivado Design Suite and Vitis Unified Software Platform, providing comprehensive tools for both hardware design and software development.
- IP Cores: A wide range of pre-built IP cores available in the Xilinx repository that can be used to accelerate development time.

9. Applications:
- Telecommunications infrastructure such as base stations and routers.
- Automotive systems including advanced driver-assistance systems (ADAS).
- Industrial automation solutions with real-time processing capabilities.
- High-definition video processing applications such as encoding/decoding and image recognition.

Functional Description

The XCZU15EG-1FFVB1156I integrates both software programmability through its ARM cores and hardware programmability through its FPGA fabric. This combination allows designers to create highly optimized applications that leverage the strengths of both architectures. The ARM Cortex-A53 cores provide general-purpose processing power suitable for running complex operating systems like Linux or real-time operating systems (RTOS), while the programmable logic can be tailored for specific tasks such as signal processing or custom control algorithms.

The device's ability to interface with high-speed peripherals via PCIe and Gigabit Ethernet makes it well-suited for data-intensive applications where low latency is critical. The inclusion of DSP slices allows developers to perform complex mathematical computations efficiently, which is particularly beneficial in applications involving audio/video processing or communications.

Additionally, the robust memory interface supports large data sets required by modern applications, ensuring that the XCZU15EG can handle demanding workloads without bottlenecks.

Conclusion

In summary, the Xilinx XCZU15EG-1FFVB1156I is a powerful MPSoC that combines advanced processing capabilities with flexible programmable logic in a single package. Its extensive specifications make it suitable for a wide variety of demanding applications across multiple industries. With its strong emphasis on performance, connectivity, security features, and support from an extensive development ecosystem, the XCZU15EG represents an excellent choice for engineers looking to implement sophisticated embedded solutions that require both software flexibility and hardware acceleration.
XCZU15EG-1FFVB1156I Compare Parts
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  • Customer Reviews
    4.95 out of 5.00 stars from 136 customer reviews from all over the world
    Paul Roy
    France
    5 stars
    2026-04-14 05:40
    Corresponds to my use
    Laura Cristina
    Spain
    5 stars
    2026-04-14 04:28
    Tested, works as expected.
    Halina Jankowska
    Poland
    5 stars
    2026-04-14 03:26
    Fast shipping, OK
    Emil Kwiatkowski
    Poland
    5 stars
    2026-04-14 00:25
    Looks genuine. Have IR logo. Not tested yet.
    Gintaras Jonas
    Lithuania
    5 stars
    2026-04-13 20:38
    looks like not genuine
    Laura Ramirez
    United States
    5 stars
    2026-04-13 19:13
    Okay, according to the announcement.